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Sealing resin - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Sealing resin Product List

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Semiconductor encapsulation resin "Mold Laser Cleaner"

Semiconductor encapsulation resin "Mold Laser Cleaner"

Semiconductor Encapsulation Resin Mold Dedicated "Mold Laser Cleaner"

Dedicated Semiconductor Encapsulation Resin "Mold Laser Cleaner IMT1200M" <<< Features >>> ■ No need to remove the mold (Insert the laser head into the mold) □ Removal of mold EMC contamination using laser ■ No need for melamine resin or rubber sheets □ High-speed mold cleaning (4 mold sets in under 30 minutes) ■ Reduction of downtime for mold equipment □ Low maintenance costs ■ No waste or odor after cleaning □ No danger to operators ■ Fully automated process □ No damage to the mold

  • Molding Equipment
  • Sealing resin

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Thermosetting resin Somatect KZ

Thermosetting resin Somatect KZ

Confident in various applications, as well as invasiveness and moisture resistance!

The Somatect KZ series is a thermosetting resin for semiconductor encapsulation. We offer a variety of applications, including grab-top resin, underfill resin, and CSP reinforcement resin.

  • Plastic utensils and containers
  • Sealing resin

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Power module encapsulation support! Thermosetting material 'Viroglass'

Power module encapsulation support! Thermosetting material 'Viroglass'

Combines heat dissipation, dielectric strength, and adhesion. It meets high power applications while simultaneously achieving sealing quality and long lifespan.

In power device and module encapsulation, heat dissipation characteristics and insulation performance are emphasized. "Bioglass" enables uniform encapsulation down to fine details due to its high filling and low-pressure moldability. Its design reduces processes, contributing to production efficiency and quality stability in mass production. 【Features】 - Insulation & heat dissipation design - High reliability encapsulation - Low-pressure processing - Fast curing / process reduction - Compatible with module encapsulation *For more details, please refer to the PDF document or feel free to contact us.

  • バイロ.png
  • Composite Materials
  • Sealing resin

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Bioglass for industrial equipment

Bioglass for industrial equipment

Thermosetting materials that combine heat dissipation, dielectric strength, and adhesion properties.

In the field of high-power industrial equipment, the reliability and longevity of power modules are important challenges. In particular, with the increase in power output, there is a demand for both heat dissipation performance and insulation performance to be achieved simultaneously. "Biloglass" addresses these challenges by enabling uniform sealing down to fine details through high filling and low-pressure molding. This prevents performance degradation of the product and allows for stable operation. 【Usage Scenarios】 - High-power power modules - Inverters - Power supply units 【Benefits of Implementation】 - Improved heat dissipation - Ensured insulation - Extended product lifespan

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  • Composite Materials
  • Sealing resin

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